Security supervisors safeguard sensitive IoT data, lower BOM
Both chips offer strong security that can be easily integrated into a design at any stage of its development. Additionally, if these parts are integrated later in the design cycle, there is no need to change the platform to accommodate them, thereby simplifying the implementation process. Compared to competitive solutions, the devices, due to their high level of integration, facilitate a 60 percent faster design cycle, while also lowering bill of materials (BOM) costs by 20 percent, claims the manufacturer. To ensure a higher level of security, these supervisors generate keys via a true random number generator (TRNG). The keys are then stored in battery-backed RAM along with certificates and other sensitive data. This data is erased when tampering is detected, a capability that meets the requirements of Federal Information Processing Standard (FIPS) Publication 140-2 at its highest security levels (Levels 3 and 4). The chips support symmetric and asymmetric cryptographic functions such as Data Encryption Standard (3DES), Advanced Encryption Standartd (AES), Rivest–Shamir–Adleman (RSA) and Elliptic Curve Digital Signature Algorithm (ECDSA), all designed and compliant to the requirements of Payment Card Industry (PCI) and FIPS140-2 certifications. The MAX36010 supports symmetric key generation for AES and 3DES, whereas the MAX36011 supports both symmetric and asymmetric key generations for AES, 3DES, RSA and ECDSA. According to Maxim Integrated, the devices draw 70 percent less current compared to the closest competitive solution.
Maxim Integrated – www.maximintegrated.com
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